METODO IN LINEA PIANA DI ESSICCAZIONE DI WAFER

Drying of particulate materials, such as wood chips (wafers/strands) for the manufacture of oriented structural board, as well as bark, and the like. The method is characterized by advancing wafers in random array and superposed and without contact above a planar surface; forcing heated air upwardly...

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Bibliographic Details
Main Authors HEAD LARRY J, SIEMERS DAVID C, DEXTER JEFFREY L
Format Patent
LanguageItalian
Published 07.05.1998
Edition4
Subjects
BLASTING
DRYING
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
HEATING
LIGHTING
MECHANICAL ENGINEERING
WEAPONS
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Summary:Drying of particulate materials, such as wood chips (wafers/strands) for the manufacture of oriented structural board, as well as bark, and the like. The method is characterized by advancing wafers in random array and superposed and without contact above a planar surface; forcing heated air upwardly through spaced apart holes defined in the stationary planar surface and through the random array of advancing wafers, while evacuating heated air and accumulated moisture above the advancing wafers. The method is distinguished by lateral shielding during forcing of heated air above the planar surface, so as to inhibit "blow-holes" among the drying wafers.
Bibliography:Application Number: IT1996RM00090