DISPPOSIZIONE CIRCUITALE ELETTRICA CON INA PIASTRA CONDUTTRICE

An electrical circuit arrangement having a printed-circuit board is proposed, in which relatively large, copper-clad regions (12, 22) are used as cooling surfaces for heat dissipation on semiconductor components (13). For this purpose, the semiconductor component (13) to be cooled is arranged on a c...

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Bibliographic Details
Main Authors WUTZ KARL, HAUBNER GEORG
Format Patent
LanguageItalian
Published 01.07.1987
Edition4
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:An electrical circuit arrangement having a printed-circuit board is proposed, in which relatively large, copper-clad regions (12, 22) are used as cooling surfaces for heat dissipation on semiconductor components (13). For this purpose, the semiconductor component (13) to be cooled is arranged on a clad region (12) of the printed-circuit board (10), and a further clad region (22) on the opposite side of the printed-circuit board (10) is connected as a cooling surface via a plurality of through-plated holes (23) to the above-mentioned clad region (12). In this way, a relatively large amount of heat can be dissipated from the semiconductor components (13), with small printed-circuit board dimensions (Figure 1).
Bibliography:Application Number: IT19840019603