SYSTEM AND METHOD FOR COOLING POWER ELECTRONICS USING HEAT SINKS

• Main Author: VOORHIS ROGER J
• Format: Patent
• Language: English
• Published: 24.04.2015
• Subjects: BLASTING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; HEATING; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; REFRIGERATION MACHINES, PLANTS OR SYSTEMS; REFRIGERATION OR COOLING; WEAPONS

A heat pump includes a main refrigerant circuit having a compressor an indoor heat exchanger and an outdoor heat exchanger and a reversing valve. A biflow expansion valve is configured to receive condensed liquid refrigerant and to expand the refrigerant. A cooling circuit in fluid communication with the main refrigerant line includes an expansion device configured to receive a portion of condensed liquid refrigerant from the main refrigerant circuit and to expand the portion of condensed liquid refrigerant. A heat sink is configured to receive the expanded portion of refrigerant from the expansion device. Power electronics are coupled to the heat sink such that the portion of expanded refrigerant from the expansion device passes through the heat sink and cools the power electronics.