SYSTEM AND METHOD FOR COOLING POWER ELECTRONICS USING HEAT SINKS

A heat pump includes a main refrigerant circuit having a compressor an indoor heat exchanger and an outdoor heat exchanger and a reversing valve. A biflow expansion valve is configured to receive condensed liquid refrigerant and to expand the refrigerant. A cooling circuit in fluid communication wit...

Full description

Saved in:
Bibliographic Details
Main Author VOORHIS ROGER J
Format Patent
LanguageEnglish
Published 24.04.2015
Subjects
BLASTING
COMBINED HEATING AND REFRIGERATION SYSTEMS
HEAT PUMP SYSTEMS
HEATING
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
REFRIGERATION MACHINES, PLANTS OR SYSTEMS
REFRIGERATION OR COOLING
WEAPONS
Online AccessGet full text

Cover

More Information
Summary:A heat pump includes a main refrigerant circuit having a compressor an indoor heat exchanger and an outdoor heat exchanger and a reversing valve. A biflow expansion valve is configured to receive condensed liquid refrigerant and to expand the refrigerant. A cooling circuit in fluid communication with the main refrigerant line includes an expansion device configured to receive a portion of condensed liquid refrigerant from the main refrigerant circuit and to expand the portion of condensed liquid refrigerant. A heat sink is configured to receive the expanded portion of refrigerant from the expansion device. Power electronics are coupled to the heat sink such that the portion of expanded refrigerant from the expansion device passes through the heat sink and cools the power electronics.
Bibliography:Application Number: IN2014DELNP7880