Systems and methods for optical metrology

Systems and methods for metrology of workpieces such as wafers, using spectrometry of multi- spot- arrays formed over a test area of the tester workpiece, for optically measuring characteristics of the tested workpiece, where the optical metrology system is configured such that the distribution of e...

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Bibliographic Details
Main Authors HOLLANDER Eyal, SCHLEIFER Elad, OREN Yonatan, BARAK Gilad
Format Patent
LanguageEnglish
Hebrew
Published 01.02.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:Systems and methods for metrology of workpieces such as wafers, using spectrometry of multi- spot- arrays formed over a test area of the tester workpiece, for optically measuring characteristics of the tested workpiece, where the optical metrology system is configured such that the distribution of energy density or flux of the multi-spot-array over the test area of the tested workpiece is such that prevents affecting the workpiece during its testing.
Bibliography:Application Number: IL20220299156