PROCESS FOR PRODUCTION OF AN ADHESIVE JOINT BETWEEN AT LEAST¹ONE BUILDING COMPONENT AND A METALLIC SUBSTRATE

Electronic components like semiconductor chips or the like, in particular, are secured to the metallic substrate in practice by adhesion. According to the invention, the adhesive joint is produced by the use of a heat-acitvated adhesive film (2) between the items to be joined. The process is prefera...

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Bibliographic Details
Main Authors GERD KOHLER, EGON EDINGER
Format Patent
LanguageEnglish
Published 27.01.1993
Edition5
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
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Summary:Electronic components like semiconductor chips or the like, in particular, are secured to the metallic substrate in practice by adhesion. According to the invention, the adhesive joint is produced by the use of a heat-acitvated adhesive film (2) between the items to be joined. The process is preferably applied in the assembly of ink-jet printing heads, in which the items to be joined are an aluminium plate (1) as the metallic substrate and the components consisting of a printed circuit board (3) and a jet module (4). The production process can thus be easily automated.
Bibliography:Application Number: IE19920002333