PEMINDAH BAHAN PEREKAT KONDUKTIF SECARA LISTRIK

• Main Author: NORMAN P. DE BASTIANI
• Format: Patent
• Language: Indonesian
• Published: 05.07.2001
• Edition: 7
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COLOUR PRINTING; CORRECTING FLUIDS; DECORATIVE ARTS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; LINING MACHINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; MOSAICS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PAPERHANGING; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; PRODUCING DECORATIVE EFFECTS; STAMPS; TARSIA WORK; TRANSPORTING; TYPEWRITERS; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

An electrically functional adhesive transfer for use in the manufacture and/or the design of flexible membrane circuits. Electrical circuit elements, instead of being printed directly upon polyester film substrates, are printed upon a carrier sheet. A pressure sensitive adhesive is applied over the exposed surfaces of the printed circuit pattern on the carrier sheet and covered by a release paper. The circuit later is applied to any desired substrate by peeling away the release paper and mounting the circuit by means of the pressure sensitive adhesive. The carrier sheet typically is peeled away after the circuit is adhesively bonded to the substrate. The carrier sheet desirably is transparent or translucent in order to facilitate visual alignment of the circuit pattern with the substrate to which it is being bonded.