ELECTRONIC DEVICE, TEST BOARD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Electrical characteristics of a mounting board over which a semiconductor device is mounted is improved. A mounting board (wiring board) includes a plurality of first through holes and second through holes extending from its upper surface bearing a semiconductor device (semiconductor package) to its...

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Bibliographic Details
Main Authors HIROSHI HOMMA, MITSUYUKI KUBO, JUNICHI YAMADA
Format Patent
LanguageChinese
English
Published 22.01.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:Electrical characteristics of a mounting board over which a semiconductor device is mounted is improved. A mounting board (wiring board) includes a plurality of first through holes and second through holes extending from its upper surface bearing a semiconductor device (semiconductor package) to its lower surface and through-hole wirings formed in the respective through holes. The mounting board has a capacitor arranged on its lower surface and electrically connected with the semiconductor device via second electrodes. Among a plurality of first electrodes formed on the upper surface of the mounting board, the several first electrodes to be connected with the capacitor are connected with one wiring formed in a first through hole with a larger diameter than a signal transmission path.
Bibliography:Application Number: HK20150107667