SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

According to one embodiment, a semiconductor light emitting device (1, 2 , 3, 5) includes a semiconductor layer (15), a p-side electrode (16), an n-side electrode (17), a fluorescent material layer (30) and a scattering layer (60). The semiconductor layer has a first surface (15a) and a second surfa...

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Main Authors FURUYAMA, HIDETO, SHIMADA, MIYOKO, KOJIMA, AKIHIRO, SUGIZAKI, YOSHIAKI, AKIMOTO, YOSUKE, TOMIZAWA, HIDEYUKI
Format Patent
LanguageChinese
English
Published 26.06.2015
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Abstract According to one embodiment, a semiconductor light emitting device (1, 2 , 3, 5) includes a semiconductor layer (15), a p-side electrode (16), an n-side electrode (17), a fluorescent material layer (30) and a scattering layer (60). The semiconductor layer has a first surface (15a) and a second surface (15b) on an opposite side to the first surface and includes a light emitting layer. The p-side electrode and the n-side electrode are provided on the semiconductor layer on a side of the second surface. The fluorescent material layer is provided on a side of the first surface and includes a plurality of fluorescent materials (31) and a first bonding material (33). The first bonding material integrates the fluorescent materials. The scattering layer is provided on the fluorescent material layer and includes scattering materials (61) and a second bonding material (62). The scattering materials are configured to scatter radiated light of the light emitting layer (13). The second bonding material (62) integrates the scattering materials (61).
AbstractList According to one embodiment, a semiconductor light emitting device (1, 2 , 3, 5) includes a semiconductor layer (15), a p-side electrode (16), an n-side electrode (17), a fluorescent material layer (30) and a scattering layer (60). The semiconductor layer has a first surface (15a) and a second surface (15b) on an opposite side to the first surface and includes a light emitting layer. The p-side electrode and the n-side electrode are provided on the semiconductor layer on a side of the second surface. The fluorescent material layer is provided on a side of the first surface and includes a plurality of fluorescent materials (31) and a first bonding material (33). The first bonding material integrates the fluorescent materials. The scattering layer is provided on the fluorescent material layer and includes scattering materials (61) and a second bonding material (62). The scattering materials are configured to scatter radiated light of the light emitting layer (13). The second bonding material (62) integrates the scattering materials (61).
Author AKIMOTO, YOSUKE
KOJIMA, AKIHIRO
SUGIZAKI, YOSHIAKI
TOMIZAWA, HIDEYUKI
SHIMADA, MIYOKO
FURUYAMA, HIDETO
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– fullname: SUGIZAKI, YOSHIAKI
– fullname: AKIMOTO, YOSUKE
– fullname: TOMIZAWA, HIDEYUKI
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Snippet According to one embodiment, a semiconductor light emitting device (1, 2 , 3, 5) includes a semiconductor layer (15), a p-side electrode (16), an n-side...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
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