SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor light emitting device (1, 2 , 3, 5) includes a semiconductor layer (15), a p-side electrode (16), an n-side electrode (17), a fluorescent material layer (30) and a scattering layer (60). The semiconductor layer has a first surface (15a) and a second surfa...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
26.06.2015
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Subjects | |
Online Access | Get full text |
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Summary: | According to one embodiment, a semiconductor light emitting device (1, 2 , 3, 5) includes a semiconductor layer (15), a p-side electrode (16), an n-side electrode (17), a fluorescent material layer (30) and a scattering layer (60). The semiconductor layer has a first surface (15a) and a second surface (15b) on an opposite side to the first surface and includes a light emitting layer. The p-side electrode and the n-side electrode are provided on the semiconductor layer on a side of the second surface. The fluorescent material layer is provided on a side of the first surface and includes a plurality of fluorescent materials (31) and a first bonding material (33). The first bonding material integrates the fluorescent materials. The scattering layer is provided on the fluorescent material layer and includes scattering materials (61) and a second bonding material (62). The scattering materials are configured to scatter radiated light of the light emitting layer (13). The second bonding material (62) integrates the scattering materials (61). |
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Bibliography: | Application Number: HK20140112691 |