BARRIER LAYER, HEATER CHIP, INK JET PRINTHEAD AND METHOD FOR REDUCING SPIKING

• Main Authors: BYRON VENCENT BELL, GUAN YIMIN
• Format: Patent
• Language: English
• Published: 03.11.2006
• Subjects: BASIC ELECTRIC ELEMENTS; CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; SEMICONDUCTOR DEVICES; STAMPS; TRANSPORTING; TYPEWRITERS

A semiconductor device containing at least one transistor and at least one heater resistor in a heater resistor area adjacent the at least one transistor on a semiconductor substrate. The device includes a silicon substrate containing contact openings for metal contacts to the at least one transistor. A barrier layer is in the contact openings and in the heater resistor area and provides a diffusion barrier/heater resistor layer. The barrier layer is selected from a group consisting of TaN, Ta/TaAl, TaN/TaAl, TiWN, TaAlN, TiN, Ta(Nx, Oy), WSi(Nx, Oy), TaSi, TaSiN, WSiN, and TaSi(Nx, Oy). A conductive layer is adjacent at least a portion of the barrier layer for providing connection between a power source and the at least one heater resistor and at least one transistor. The semiconductor device is devoid of a patterned and etched barrier layer in the heater resistor area.