ADHESIVE TAPE AND SUBSTRATE FOR ADHESIVE TAPE
The present invention provides an adhesive tape comprising a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate comprises the following Component A, Component B and Component C: Component A: a thermoplastic resin having a carbonyl oxygen atom in the m...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
12.04.2002
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides an adhesive tape comprising a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate comprises the following Component A, Component B and Component C: Component A: a thermoplastic resin having a carbonyl oxygen atom in the molecular skeleton Component B: a polymer alloy containing an ethylene component and a propylene component Component C: an inorganic metal compound surface-treated with a silane coupling agent but substantially no halogen atom. The adhesive tape and the substrate for the adhesive tape of the present invention are free of generation of dioxin or a toxic gas upon incineration, are superior in flexibility, resistance to thermal deformation, flame resistance and resistance to surface whitening, and show suitable stretchability and mechanical strength. |
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Bibliography: | Application Number: HK20020100742 |