SEMICONDUCTOR SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME

• Main Authors: KAZUHIRO IKEMURA, TADAAKI HARADA, TSUTOMU NISHIOKA, SADAHITO MISUMI, MINORU YAMANE, SHINICHI OHIZUMI, TOSHITSUGU HOSOKAWA, TAKASHI TANIGUCHI
• Format: Patent
• Language: English
• Published: 28.05.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS; THEIR PREPARATION OR CHEMICAL WORKING-UP