Adhesive composition with small particle size for microelectronic devices

This invention is an improved adhesive composition prepared from at least one organic polymer resin, an inorganic filler, and a fugitive liquid, in which the liquid and organic polymer resin are each substantially insoluble in the other; and in which the improvement comprises that the at least one o...

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Bibliographic Details
Main Authors BING WU, JUN, KATHY, M, COSTELLO, TIMOTHY, G
Format Patent
LanguageEnglish
Published 17.11.2000
Edition7
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:This invention is an improved adhesive composition prepared from at least one organic polymer resin, an inorganic filler, and a fugitive liquid, in which the liquid and organic polymer resin are each substantially insoluble in the other; and in which the improvement comprises that the at least one organic polymer resin be present in particulate form of particle size that is 25 mu or smaller. Adhesive compositions so prepared can be used on dies-400 milx400 mil or greater on metal substrates without significant delamination.
Bibliography:Application Number: HK20000104842