Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system

A device and method for cooling an integrated circuit package-in particular, a microprocessor-within an enclosed computer system. The device comprises a blower, a first heat sink attached to the microprocessor, and a first air duct coupling the blower to the first heat sink. The blower has an air in...

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Bibliographic Details
Main Author NELSON, DARYL, J
Format Patent
LanguageEnglish
Published 20.11.1998
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A device and method for cooling an integrated circuit package-in particular, a microprocessor-within an enclosed computer system. The device comprises a blower, a first heat sink attached to the microprocessor, and a first air duct coupling the blower to the first heat sink. The blower has an air intake from the exterior of the computer system. The blower generates an air stream which flows through the first air duct to the first heat sink for cooling the first microprocessor. A second air duct connected to the first heat sink may be used to subsequently direct the air stream to a second heat sink for cooling a second microprocessor. An efficient ducted heat sink for use in this cooling system can be easily constructed by attaching two extruded heat sinks.
Bibliography:Application Number: HK19980103488