Systems and methods for bonding a downhole tool to a borehole tubular

The present disclosure provides methods for bonding a first downhole tool to a borehole tubular, which include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The...

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Bibliographic Details
Main Authors Frank Acosta, Lonnie Helms, Sam Lewis, William Cecil Jr. Pearl
Format Patent
LanguageEnglish
Published 22.05.2024
Subjects
EARTH DRILLING
EARTH DRILLING, e.g. DEEP DRILLING
FIXED CONSTRUCTIONS
MINING
OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS
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Summary:The present disclosure provides methods for bonding a first downhole tool to a borehole tubular, which include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The methods may also include rupturing the shells of the solder particles to release the liquid metal cores. The methods may further include bonding the first downhole tool to the borehole tubular by allowing the released liquid metal core to solidify.
Bibliography:Application Number: GB202214038