Assembly of a chip to a substrate

Method of bonding a semiconductor chip 401 to an organic laminate substrate 403 using solder. Without cooldown from the bonding temperature to room temperature, the underfill between the semiconductor chip and the organic laminate substrate is dispensed. The underfill is cured within a range of temp...

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Bibliographic Details
Main Authors Paul S Andry, Mukta Ghate Farooq, Katsuyuki Sakuma, Russell Kastberg
Format Patent
LanguageEnglish
Published 10.08.2022
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Method of bonding a semiconductor chip 401 to an organic laminate substrate 403 using solder. Without cooldown from the bonding temperature to room temperature, the underfill between the semiconductor chip and the organic laminate substrate is dispensed. The underfill is cured within a range of temperatures higher than the underfill dispense temperature. Alternatively, a semiconductor chip that has pillars 402 protruding from a lower surface at a pitch of 55 microns or less, has caps of first solder 406 affixed to lower ends of the pillars. The organic laminate substrate has pads 404 protruding from an upper surface thereof at the same pitch as the semiconductor chip, with caps of second solder 408 affixed to upper faces of the pads. Two or more dots of volatile tacky adhesive are attached to the upper surface of the organic laminate substrate to the lower surface of the semiconductor chip.
Bibliography:Application Number: GB20210017762