Packaging for a mems transducer
A present application describes a MEMS transducer package, e.g. MEMS microphone, having a substrate layer 300 which defines a recess 310. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrat...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
23.09.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A present application describes a MEMS transducer package, e.g. MEMS microphone, having a substrate layer 300 which defines a recess 310. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate, thus creating a side port MEMS microphone. The recess lays underneath a cavity 108 of the MEMS package. In some embodiments there is an additional substrate layer 320 that can house an embedded integrated circuit chip 15. |
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Bibliography: | Application Number: GB20190005924 |