Packaging for a mems transducer

A present application describes a MEMS transducer package, e.g. MEMS microphone, having a substrate layer 300 which defines a recess 310. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrat...

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Bibliographic Details
Main Authors Roberto Brioschi, Rkia Achehboune
Format Patent
LanguageEnglish
Published 23.09.2020
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Summary:A present application describes a MEMS transducer package, e.g. MEMS microphone, having a substrate layer 300 which defines a recess 310. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate, thus creating a side port MEMS microphone. The recess lays underneath a cavity 108 of the MEMS package. In some embodiments there is an additional substrate layer 320 that can house an embedded integrated circuit chip 15.
Bibliography:Application Number: GB20190005924