Module with transmit optical subassembly and receive optical subassembly

• Main Authors: Gerald Cois Byrd, Karlheinz Muth, Chia-Te Chou
• Format: Patent
• Language: English
• Published: 08.07.2020
• Subjects: OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS

Optoelectronic module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing. Transceiver assembly includes an optical subassembly having inter alia a plurality of contact pads for establishing electrical connections to test equipment probes. The optical subassembly is separately testable by supplying power through the contact pads and sending data to and and/or receiving data from the optical subassembly through the contact pads.