Method of manufacturing electronic board, composite sheet, and electronic board

A method of manufacturing an electronic board includes preparing a composite sheet having a composite layer that includes a solder part and a resin part, placing the composite layer on a substrate, placing a first electronic component on the composite layer, and heating the solder part up to a tempe...

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Bibliographic Details
Main Authors Tadashi Kosuga, Tin-Lup Wong
Format Patent
LanguageEnglish
Published 08.12.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method of manufacturing an electronic board includes preparing a composite sheet having a composite layer that includes a solder part and a resin part, placing the composite layer on a substrate, placing a first electronic component on the composite layer, and heating the solder part up to a temperature at which the solder part of the composite layer is melted within a reflow furnace.
Bibliography:Application Number: GB20190013504