Integrated MEMS transducers

A MEMS transducer package 900 comprises a package cover 313 and an integrated circuit die 309 comprising a bonding region 314 for bonding with the package cover. The integrated circuit die 309 comprises an integrated MEMS transducer 311 and integrated electronic circuitry 312 in electrical connectio...

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Bibliographic Details
Main Author Tsjerk Hoekstra
Format Patent
LanguageEnglish
Published 23.05.2018
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:A MEMS transducer package 900 comprises a package cover 313 and an integrated circuit die 309 comprising a bonding region 314 for bonding with the package cover. The integrated circuit die 309 comprises an integrated MEMS transducer 311 and integrated electronic circuitry 312 in electrical connection with the integrated MEMS transducer. The footprint of the integrated electronic circuitry 312 at least overlaps the bonding region 314 of the integrated circuit die 309. The proposed arrangement reduces the size and space of the package and leads to a more compact MEMS device. The MEMS device may be a bottom port acoustic or microphone MEMS. In another MEMS transducer package arrangement there comprises a package cover and an integrated circuit die comprising an integrated MEMS transducer wherein the package cover comprises integrated electronic circuitry 912, and the footprint of the integrated electronic circuitry 312 at least overlaps the bonding region 314.
Bibliography:Application Number: GB20180001387