Method and apparatus for joining members for downhole and high temperature applications
A method of attaching members is provided. In one aspect, the method includes placing a bonding material comprising at least one of silver micro particles)and silver nano particles on a surface of a first member; placing the first member with the surface of the first member having the bonding materi...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
03.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | A method of attaching members is provided. In one aspect, the method includes placing a bonding material comprising at least one of silver micro particles)and silver nano particles on a surface of a first member; placing the first member with the surface of the first member having the bonding material thereon on a surface of a second member; heating the bonding material to a selected temperature while applying a selected pressure on at least one of the first member and second member for a selected time period to sinter the bonding material to attach the first member to the second member. |
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Bibliography: | Application Number: GB20130022191 |