Method and apparatus for joining members for downhole and high temperature applications

A method of attaching members is provided. In one aspect, the method includes placing a bonding material comprising at least one of silver micro particles)and silver nano particles on a surface of a first member; placing the first member with the surface of the first member having the bonding materi...

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Main Authors THOMAS KRUSPE, ERWIN PEINER, SEBASTIAN JUNG, GERHARD PALM, ANDREAS WAAG, JULIAN KAHLER, ANDREJ STRANZ
Format Patent
LanguageEnglish
Published 03.09.2014
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Summary:A method of attaching members is provided. In one aspect, the method includes placing a bonding material comprising at least one of silver micro particles)and silver nano particles on a surface of a first member; placing the first member with the surface of the first member having the bonding material thereon on a surface of a second member; heating the bonding material to a selected temperature while applying a selected pressure on at least one of the first member and second member for a selected time period to sinter the bonding material to attach the first member to the second member.
Bibliography:Application Number: GB20130022191