Process for cutting a block using a planar array of wires

Process for cutting a block of material 12 into a multiplicity of wafers by movement of a planar array of parallel wires 14 relative to the block (or vice versa) in a direction perpendicular to the plane of the wires. Before the application of a slurry or fluid, the array of wires is brought into co...

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Bibliographic Details
Main Authors STIAN SANNES, TORGRIM ANDERSEN, ERIK SAUAR, OIVIND GJERSTAD, KRISTIAN L AAS
Format Patent
LanguageEnglish
Published 06.07.2011
Subjects
BROACHING
FILING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PLANING
SAWING
SCRAPING
SHEARING
SLOTTING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:Process for cutting a block of material 12 into a multiplicity of wafers by movement of a planar array of parallel wires 14 relative to the block (or vice versa) in a direction perpendicular to the plane of the wires. Before the application of a slurry or fluid, the array of wires is brought into contact with the block in a dry condition, in order to introduce a bow in the array of wires caused by a contact pressure between the wires and the block, and thereby keeping the array of wires against the block in their intended positions. Preferably, the block is formed with chamfers on its corners first contacted by the array of wires. The wires of the array may be kept in position by regular equally spaced guide indentations formed on the corner of the block. Preferably, the bow in the wires is introduced before the start up of the wires.
Bibliography:Application Number: GB20090022708