Integrated cavity in PCB pressure sensor

Described herein is an integrated pressure sensor assembly. The integrated pressure sensor assembly includes a printed circuit board assembly comprising a plurality of boards; a pressure die mounted on at least a portion of the printed circuit board assembly; and a housing engaged to the printed cir...

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Bibliographic Details
Main Authors SALEH AHMED, GARY CASEY
Format Patent
LanguageEnglish
Published 14.03.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
PRINTED CIRCUITS
TESTING
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Summary:Described herein is an integrated pressure sensor assembly. The integrated pressure sensor assembly includes a printed circuit board assembly comprising a plurality of boards; a pressure die mounted on at least a portion of the printed circuit board assembly; and a housing engaged to the printed circuit board assembly. The printed circuit board assembly includes at least one pressure transmission channel and at least one electrical transmission channel.
Bibliography:Application Number: GB20100013750