Methods for applying thermal barrier coating systems

Methods for coating a substrate includes depositing on the substrate, a inner bond coat layer of a bond coat composition comprising, in weight percent, 14-20 % Cr, 5-8 %n Al, 8-12 % Co, 3-7 % Ta, 0.1-0.6 % Hf, 0.1-0.5 % Y, up to about 1% Si, 0.005-0.020 % Zr, 0.04-0.08 % C, 0.01-0.02% B, with a rema...

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Bibliographic Details
Main Authors DAVID JOHN WORTMAN, BANGALORE ASWATHA NAGARAJ, NICOLE MARIE POLLEY, ROGER DALE WUSTMAN, WILLIAM BRYAN CONNOR
Format Patent
LanguageEnglish
Published 01.09.2010
Subjects
ALLOYS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
FERROUS OR NON-FERROUS ALLOYS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:Methods for coating a substrate includes depositing on the substrate, a inner bond coat layer of a bond coat composition comprising, in weight percent, 14-20 % Cr, 5-8 %n Al, 8-12 % Co, 3-7 % Ta, 0.1-0.6 % Hf, 0.1-0.5 % Y, up to about 1% Si, 0.005-0.020 % Zr, 0.04-0.08 % C, 0.01-0.02% B, with a remainder including nickel (Ni) and incidental impurities, wherein the bond coat composition is substantially free of rhenium; forming an aluminum-containing layer overlying the inner bond coat layer; and, optionally, depositing a thermal barrier coating composition overlying the aluminum-containing layer.
Bibliography:Application Number: GB20100010126