Atomic layer deposited tantalum containing adhesion layer
Apparatus and methods of fabricating an atomic layer deposited tantalum containing adhesion layer within at least one dielectric material in the formation of a metal, wherein the atomic layer deposition tantalum containing adhesion layer is sufficiently thin to minimize contact resistance and maximi...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
27.10.2010
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Subjects | |
Online Access | Get full text |
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Summary: | Apparatus and methods of fabricating an atomic layer deposited tantalum containing adhesion layer within at least one dielectric material in the formation of a metal, wherein the atomic layer deposition tantalum containing adhesion layer is sufficiently thin to minimize contact resistance and maximize the total cross-sectional area of metal, including but not limited to tungsten, within the contact. |
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Bibliography: | Application Number: GB20060020833 |