Solder alloy

A solder alloy for use in the manufacture of electrical fuses, the alloy comprising: Copper - from 0.5 to 4 wt.% Silver - from 0.1 to 1 wt.% Antimony - from 0.2 to 3 wt.% Bismuth - from 0 to 1.5 wt.% Zinc - from 0 to 2 wt.% Nickel - from 0 to 0.3 wt.% Cobalt - from 0 to 0.3 wt.% Phosphorous - from 0...

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Bibliographic Details
Main Authors ANTHONY INGHAM, GARY CUNNING
Format Patent
LanguageEnglish
Published 24.12.2008
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A solder alloy for use in the manufacture of electrical fuses, the alloy comprising: Copper - from 0.5 to 4 wt.% Silver - from 0.1 to 1 wt.% Antimony - from 0.2 to 3 wt.% Bismuth - from 0 to 1.5 wt.% Zinc - from 0 to 2 wt.% Nickel - from 0 to 0.3 wt.% Cobalt - from 0 to 0.3 wt.% Phosphorous - from 0 to 0.01 wt.% Indium-from 0 to 0.2 wt.% Germanium - from 0 to 0.1 wt.% and the balance tin, together with unavoidable impurities, provided that if the silver content is 0.5 wt.% or less, then copper is present in an amount of not less than 0.9 wt.% and/or bismuth is present in an amount of not less than 0.1 wt.%.
Bibliography:Application Number: GB20070009021