Lead-free solder alloy

An alloy suitable for use in tinning or the manufacture of heat exchangers, the alloy comprising (by weight): ```1.5 - 6 wt.% copper, ```0.08 - 1.5 wt.% bismuth, ```0 - 1.5 wt.% silver, ```0 - 0.02 wt.% phosphorus, ```0 - 0.02 wt.% germanium, ```0 - 0.15 wt% of indium, ```0 - 0.3 wt% of silicon, ```...

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Bibliographic Details
Main Authors ANTHONY INGHAM, GERARD CAMPBELL
Format Patent
LanguageEnglish
Published 07.10.2009
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:An alloy suitable for use in tinning or the manufacture of heat exchangers, the alloy comprising (by weight): ```1.5 - 6 wt.% copper, ```0.08 - 1.5 wt.% bismuth, ```0 - 1.5 wt.% silver, ```0 - 0.02 wt.% phosphorus, ```0 - 0.02 wt.% germanium, ```0 - 0.15 wt% of indium, ```0 - 0.3 wt% of silicon, ```0 - 0.2 wt% of zirconium, ```one or both of 0.02 - 0.2 wt.% nickel and/or ```0.01 - 0.2 wt.% cobalt, ```and the balance tin, together with unavoidable impurities.
Bibliography:Application Number: GB20050021636