Solder alloy and a semiconductor device using the solder alloy

A solder alloy contains from 3 to 5 wt % of antimony (Sb), not more than 0.2 wt % of germanium (Ge), and the balance of tin (Sn). In a semiconductor device, the solder alloy can be used to join a semiconductor chip and a conductor pattern on the front surface of an insulative substrate, a conductor...

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Bibliographic Details
Main Authors SHIN SOYANO, YOSHIKAZU TAKAHASHI, AKIRA MOROZUMI
Format Patent
LanguageEnglish
Published 10.10.2007
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:A solder alloy contains from 3 to 5 wt % of antimony (Sb), not more than 0.2 wt % of germanium (Ge), and the balance of tin (Sn). In a semiconductor device, the solder alloy can be used to join a semiconductor chip and a conductor pattern on the front surface of an insulative substrate, a conductor pattern on the back surface of the insulative substrate and a heat sink plate, and the semiconductor chip and a wiring conductor. The solder alloy exhibits excellent wettability and satisfactory bonding performance.
Bibliography:Application Number: GB20060001776