Semiconductor device capsule

A semiconductor device capsule (30) comprising a semiconductor assembly (32) mounted between opposed poles (34,36). At least one of the poles (34,36) includes slots (38) around the location of the or each chip or group of chips (46) within the semiconductor assembly (32) to define a contact body por...

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Bibliographic Details
Main Authors ANDREW GOODE, JOHN BALLAD
Format Patent
LanguageEnglish
Published 22.04.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device capsule (30) comprising a semiconductor assembly (32) mounted between opposed poles (34,36). At least one of the poles (34,36) includes slots (38) around the location of the or each chip or group of chips (46) within the semiconductor assembly (32) to define a contact body portion (37) on which the or each chip or group of chips (46) is mounted and reduce the thickness of a laterally continuous body portion (39) of the pole (36).
Bibliography:Application Number: GB20040012778