A semiconductor device with a trench
A trench 2 in a semiconductor device is provided with lateral recesses 30 in one or both of its sidewalls which provide discrete localised increases in trench width. When the trench is filled, e.g. by CVD with polysilicon, the formation of voids is thereby avoided. The recesses may have a rectilinea...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
08.02.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A trench 2 in a semiconductor device is provided with lateral recesses 30 in one or both of its sidewalls which provide discrete localised increases in trench width. When the trench is filled, e.g. by CVD with polysilicon, the formation of voids is thereby avoided. The recesses may have a rectilinear, triangular or arcuate cross-section and extend to the bottom of the trench. |
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Bibliography: | Application Number: GB20040017024 |