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Summary:The present invention provides a vacuum stage device that moves a substrate to be processed in a vacuum environment. In a substrate transfer device in accordance with the present invention, a wafer mounted to a wafer platen is moved in a vacuum processing chamber. This substrate transfer device includes a first driving mechanism for moving the wafer platen in a Y 1 direction, and a second driving mechanism that is provided in the vacuum processing chamber and linearly reciprocates the wafer platen in X 1 and X 2 directions at a high speed.
Bibliography:Application Number: GB20020020093