Diffusion barrier layer for a semiconductor device

A semiconductor device containing a diffusion barrier layer is provided. The semiconductor device includes at least a semiconductor substrate containing conductive metal elements; and, a diffusion barrier layer applied to at least a portion of the substrate in contact with the conductive metal eleme...

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Main Authors DARRYL D RESTAINO, JOHN ANTHONY FITZSIMMONS, SAMPATH PURUSHOTHAMAN, STEPHEN ALAN COHEN, EVA SIMONYI, KANG-WOOK LEE, HORATIO SEYMOUR WILDMAN, STEPHEN MCCONNELL GATES, TIMOTHY JOSEPH DALTON, LYNNE M GIGNAC, PAUL CHARLES JAMISON
Format Patent
LanguageEnglish
Published 13.10.2004
Edition7
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Summary:A semiconductor device containing a diffusion barrier layer is provided. The semiconductor device includes at least a semiconductor substrate containing conductive metal elements; and, a diffusion barrier layer applied to at least a portion of the substrate in contact with the conductive metal elements, the diffusion barrier layer having an upper surface and a lower surface and a central portion, and being formed from silicon, carbon, nitrogen and hydrogen with the nitrogen being non-uniformly distributed throughout the diffusion barrier layer. Thus, the nitrogen is more concentrated near the lower and upper surfaces of the diffusion barrier layer as compared to the central portion of the diffusion barrier layer. Methods for making the semiconductor devices are also provided.
Bibliography:Application Number: GB20010002506