Cutting oil composition

• Main Authors: TOSHIYA HAGIHARA, JIRO HASHIMOTO, KAZUHIKO NISHIMOTO
• Format: Patent
• Language: English
• Published: 26.06.2002
• Edition: 7
• Subjects: CHEMISTRY; FUELS; LUBRICANTS; LUBRICATING COMPOSITIONS; METALLURGY; PEAT; PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATINGINGREDIENTS IN A LUBRICATING COMPOSITION

The present invention relates to a cutting oil comprising (a) a polyether compound represented by the formula (I):wherein each of R1 and R2, which may be identical or different, is hydrogen atom or a hydrocarbon group having 1 to 24 carbon atoms, at least one of which is a hydrocarbon group; EO is oxyethylene group; AO is an oxyalkylene group having 3 or 4 carbon atoms; and each of m and n is 1 to 50, wherein a sum of m and n is from 4 to 100; a cutting oil composition comprising the above cutting oil and an abrasive; a cutting method using the above cutting oil composition; and a process of cleaning a wafer, comprising the steps of cleaning a wafer obtainable by cutting an ingot with a wire saw using the above cutting oil composition; heating the resulting waste water to a temperature equal to or higher than a cloud point of a polyether compound represented by the formula (I) contained in the waste water, to allow separation into an oil phase and an aqueous phase; and removing the oil phase comprising the polyether compound from the waste water. According to the present invention, there can be obtained excellent dispersibility of the abrasive, and excellent re-dispersibility, cutting performance and workability when sedimented, and the object to be cut obtained after cutting can be easily cleaned.