Light emitting diode

A layer of opaque material 14 is interposed between the LED die 16 and the die-attach epoxy 20. The overall thermal resistance of the LED die is reduced by using a metal-filled epoxy 20 and by using a metal as the opaque layer. The overall light output of the LED lamp package may be further improved...

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Bibliographic Details
Main Authors WILLIAM R IMLER, DANIEL A STELGERWALD, PAUL A MARTIN, SERGE L RUDAZ
Format Patent
LanguageEnglish
Published 04.08.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A layer of opaque material 14 is interposed between the LED die 16 and the die-attach epoxy 20. The overall thermal resistance of the LED die is reduced by using a metal-filled epoxy 20 and by using a metal as the opaque layer. The overall light output of the LED lamp package may be further improved by selecting an opaque metal layer to have a high reflectivity to the light that is emitted from the LED chip. Furthermore, an additional layer 10 may be interposed between the LED die 16 and the opaque material 14 to promote adhesion.
Bibliography:Application Number: GB19990001716