Detecting erosion of the target surface of sputtering source during cathodic sputtering

The sputtering source has a target body (1) which at predetermined locations, which are invariable during the cathode sputtering operation, has at least one sensor (14) for directly detecting through-erosion of the target body at the predetermined location. Photometric or electrical quantities, temp...

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Bibliographic Details
Main Author URS WEGMANN
Format Patent
LanguageEnglish
Published 06.07.1988
Edition4
Subjects
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:The sputtering source has a target body (1) which at predetermined locations, which are invariable during the cathode sputtering operation, has at least one sensor (14) for directly detecting through-erosion of the target body at the predetermined location. Photometric or electrical quantities, temperature or pressure in the process chamber may be used as the measured quantities. This has an advantage over known apparatus using ancillary quantities such as temperature or the energy consumed which require preliminary calibration and therefore suffer from uncertainties.
Bibliography:Application Number: GB19870027620