Procédé de fabrication d'une couche abradable

• Main Authors: ESTOURNES, Claude Gilbert Jean-Pierre, SELEZNEFF, Serge Georges Vladimir, FREGEAC, Arnaud Louis Gabriel, ANSART, Florence, ROUSSELLE, Mélanie, FRADET, Guillaume
• Format: Patent
• Language: French
• Published: 02.12.2022
• Subjects: CASTING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING; WORKING METALLIC POWDER

Procédé de fabrication d'une couche abradable et d'un substrat revêtu par cette couche, comprenant les étapes suivantes : préparation d'une composition pulvérulente (30) comprenant au moins des particules céramiques et une charge inorganique possédant une structure cristallographique lamellaire, la teneur volumique de la charge inorganique dans la composition pulvérulente étant comprise entre 1 et 75%,compression de la composition pulvérulente (30), etfrittage de la composition pulvérulente (30) ainsi comprimée pour obtenir la couche abradable (12). Fig. 11. A method for manufacturing an abradable layer and a substrate coated with this layer, may include: preparing a powder composition including at least ceramic particles and an inorganic filler having a lamellar crystallographic structure, the volume content of the inorganic filler in the powder composition being in a range of from 1 to 75%; compressing the powder composition; and sintering the powder composition thus compressed in order to obtain the abradable layer.