PROCEDE DE COLLAGE DIRECT METAL-METAL
A method for assembling a first substrate and a second substrate by metal-metal direct bonding, includes providing a first layer of a metal at the surface of the first substrate and a second layer of the metal at the surface of the second substrate, the first and second metal layers having a tensile...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | French |
Published |
03.08.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A method for assembling a first substrate and a second substrate by metal-metal direct bonding, includes providing a first layer of a metal at the surface of the first substrate and a second layer of the metal at the surface of the second substrate, the first and second metal layers having a tensile stress (σi) between 30% and 100% of the tensile yield strength (σe) of the metal; assembling the first and second substrates at a bonding interface by directly contacting the first and second tensile stressed metal layers; and subjecting the assembly of the first and second substrates to a stabilization annealing at a temperature lower than or equal to a temperature threshold beyond which the first and second tensile stressed metal layers are plastically compressively deformed. |
---|---|
Bibliography: | Application Number: FR20160056818 |