PROCEDE ET SYSTEME DE DECOUPE EN TRANCHES D'UNE PIECE EN MATERIAU SEMI-CONDUCTEUR OU EN CERAMIQUE, A L'AIDE D'UN FIL DE DECOUPE ET DE PARTICULES ABRASIVES

In the method, the wire (1) is driven in translation in at least one direction (F2) and, during its displacement in translation (F2), it penetrates into the piece to be cut (2) via a penetration face (20A) of said piece (2). According to the invention, a cushioning layer (9A) is positioned opposite...

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Bibliographic Details
Main Authors PENOT, JEAN-DANIEL, GRILLET, NASTASJA
Format Patent
LanguageFrench
Published 29.06.2018
Subjects
BROACHING
FILING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PLANING
SAWING
SCRAPING
SHEARING
SLOTTING
TRANSPORTING
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Summary:In the method, the wire (1) is driven in translation in at least one direction (F2) and, during its displacement in translation (F2), it penetrates into the piece to be cut (2) via a penetration face (20A) of said piece (2). According to the invention, a cushioning layer (9A) is positioned opposite the penetration face (20A) of the piece to be cut (2) such that, before penetrating into the piece (2), the wire (1) passes through the cushioning layer (9A). If the wire (1) is driven in translation in an alternating back-and-forth motion, and penetrates into the piece to be cut (2) in alternation via two opposite penetration faces (20A, 20B), two cushioning layers (9A, 9B) are respectively positioned opposite the two penetration faces.
Bibliography:Application Number: FR20160050287