PROCEDE D'ENCAPSULATION D'UN DISPOSITIF MICROELECTRONIQUE AVEC UN TROU DE LIBERATION DE DIMENSION VARIABLE

A method of encapsulating a microelectronic device (100), comprising the following steps: making a sacrificial portion for covering the device; making a cover (106) for covering the sacrificial portion; the cover (106) comprises two superposed layers (108, 110) of discrete materials with different r...

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Bibliographic Details
Main Authors BAILLIN XAVIER, PORNIN JEAN-LOUIS
Format Patent
LanguageFrench
Published 15.12.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A method of encapsulating a microelectronic device (100), comprising the following steps: making a sacrificial portion for covering the device; making a cover (106) for covering the sacrificial portion; the cover (106) comprises two superposed layers (108, 110) of discrete materials with different residual stresses and / or coefficients of thermal expansion; etching a trench (112) through the cover, the pattern of which comprises a curve and / or two non-parallel straight segments; engraving the sacrificial portion through the trench; depositing a sealing material on the trench. During the etching of the sacrificial portion, a portion (116) of the hood defined by the trench deforms under the effect of a mechanical stress generated by the residual stresses and / or thermal expansion of the layers of the hood and increases the dimensions of the trench, and stress is eliminated before the trench is sealed.
Bibliography:Application Number: FR20150061474