PROCEDE POUR UN POLISSAGE MECANO-CHIMIQUE DE SUBSTRATS CONTENANT DU RUTHENIUM ET DU CUIVRE

Il est fourni un procédé pour un polissage mécano-chimique d'un substrat comprenant du ruthénium et du cuivre. A method for chemical mechanical polishing of a substrate comprising ruthenium and copper is provided wherein the substrate is contacted with a polishing slurry containing an abrasive,...

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Bibliographic Details
Main Authors CHAO CHING-HSUN, COOK LEE MELBOURNE, WANG JIUN-FANG, WANG HONGYU
Format Patent
LanguageFrench
Published 29.01.2016
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:Il est fourni un procédé pour un polissage mécano-chimique d'un substrat comprenant du ruthénium et du cuivre. A method for chemical mechanical polishing of a substrate comprising ruthenium and copper is provided wherein the substrate is contacted with a polishing slurry containing an abrasive, hypochlorite, a copolymer of acrylic acid and methacrylic acid, benzotriazole, poly(methyl vinyl ether) and a non-ionic surfactant at a pH of 9 to 11.
Bibliography:Application Number: FR20150057186