MODULE ELECTRONIQUE DE PUISSANCE A CAPACITE INTEGREE

The module has a parallelepiped housing (1) comprising a bottom (2), which is housed with power electronics components i.e. chips (13), and an upper wall (7). A capacitance forming device is placed in the housing, where the device is formed of a dielectric film (16) surrounded by an envelope (15). T...

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Bibliographic Details
Main Authors MORELLE JEAN-MICHEL, MORLIERE BENJAMIN
Format Patent
LanguageFrench
Published 09.12.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The module has a parallelepiped housing (1) comprising a bottom (2), which is housed with power electronics components i.e. chips (13), and an upper wall (7). A capacitance forming device is placed in the housing, where the device is formed of a dielectric film (16) surrounded by an envelope (15). The capacitance is placed above the components on a side of the upper wall. An auxiliary housing is formed in the upper wall of the housing, where the capacitance forming device is received in the auxiliary housing. The components are arranged on conductors in the form of copper strips (11). An independent claim is also included for an electronic power module and electronic control card assembly.
Bibliography:Application Number: FR20110055254