Semiconductor integrated circuit mounting assembly

• Main Author: MIYOSHI TADAYOSHI
• Format: Patent
• Language: English; French
• Published: 17.10.1997
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The semiconductor mounting structure comprises a combined rigid and flexible substrate (10) within which a flexible part is provided. The flexible part is provided with a connection terminal for a semiconductor integrated circuit (20), the integrated circuit being mounted directly on this section. A...