Semiconductor integrated circuit mounting assembly

• Main Author: MIYOSHI TADAYOSHI
• Format: Patent
• Language: English; French
• Published: 17.10.1997
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The semiconductor mounting structure comprises a combined rigid and flexible substrate (10) within which a flexible part is provided. The flexible part is provided with a connection terminal for a semiconductor integrated circuit (20), the integrated circuit being mounted directly on this section. A rigid part of the composite substrate (16) is provided with an electrode (19) for mounting an electronic component, and also provided with an input/output terminal (25). The semiconductor integrated circuit is sealed and embedded in resin after mounting within the structure. A number of integrated circuits may be mounted within the flexible part of the structure, whilst the rigid part may provide support for a number of other electronic components. Structure de montage de semi-conducteur comprenant un substrat flexible rigide (10), dans laquelle une partie flexible est pourvue d'une borne de connexion pour un circuit intégré à semi-conducteurs (20), le circuit intégré à semi-conducteurs (20) étant directement connecté et monté sur ladite borne de connexion pour le circuit intégré à semi-conducteurs (20). Une partie rigide (16) dudit substrat flexible rigide (10) est pourvue d'une électrode (19) pour monter un composant électronique et d'une borne d'entrée/sortie externe (25).