Semiconductor integrated circuit mounting assembly
The semiconductor mounting structure comprises a combined rigid and flexible substrate (10) within which a flexible part is provided. The flexible part is provided with a connection terminal for a semiconductor integrated circuit (20), the integrated circuit being mounted directly on this section. A...
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Main Author | |
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Format | Patent |
Language | English French |
Published |
17.10.1997
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | The semiconductor mounting structure comprises a combined rigid and flexible substrate (10) within which a flexible part is provided. The flexible part is provided with a connection terminal for a semiconductor integrated circuit (20), the integrated circuit being mounted directly on this section. A rigid part of the composite substrate (16) is provided with an electrode (19) for mounting an electronic component, and also provided with an input/output terminal (25). The semiconductor integrated circuit is sealed and embedded in resin after mounting within the structure. A number of integrated circuits may be mounted within the flexible part of the structure, whilst the rigid part may provide support for a number of other electronic components.
Structure de montage de semi-conducteur comprenant un substrat flexible rigide (10), dans laquelle une partie flexible est pourvue d'une borne de connexion pour un circuit intégré à semi-conducteurs (20), le circuit intégré à semi-conducteurs (20) étant directement connecté et monté sur ladite borne de connexion pour le circuit intégré à semi-conducteurs (20). Une partie rigide (16) dudit substrat flexible rigide (10) est pourvue d'une électrode (19) pour monter un composant électronique et d'une borne d'entrée/sortie externe (25). |
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Bibliography: | Application Number: FR19970004487 |