Procédé pour connecter des circuits électoniques dans un module multi-puces à substrat co-cuit, et module multi-puces ainsi obtenu

The multi-chip module comprises a co-fired substrate, and, on at least ont face of the substrate, a set of superimposed ceramic insulating layers, fired at a temperature substantially smaller than the firing temperature of the substrate. Conducting interconnection lines are formed in thick layers de...

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Bibliographic Details
Main Author DE GIVRY JACQUES
Format Patent
LanguageFrench
Published 07.06.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The multi-chip module comprises a co-fired substrate, and, on at least ont face of the substrate, a set of superimposed ceramic insulating layers, fired at a temperature substantially smaller than the firing temperature of the substrate. Conducting interconnection lines are formed in thick layers deposited between said ceramic insulating layers. Electronic components are mounted at the surface of the set of ceramic layers.
Bibliography:Application Number: FR19940001511