PROCEDE DE MONTAGE DE MICRO-COMPOSANTS ELECTRONIQUES SUR UN SUPPORT ET PRODUIT REALISABLE PAR LE PROCEDE

• Main Authors: JEAN-PAUL LALFER, JACQUES DE GIVRY, JEAN-CLAUDE VALLET
• Format: Patent
• Language: French
• Published: 26.01.1990
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Le procédé permet de monter, sur un support de circuit imprimé, des micro-composants électroniques, notamment des porte-puce, munis, sur leur face inférieure, de contacts soudables 20. On fixe à plat le micro-composant au support par l'intermédiaire d'une cale 24 en un matériau ayant un coefficient de dilatation comparable à celui du micro-composant. On relie les contacts 20 du micro-composant au circuit imprimé par des tronçons 22 de fil souple présentant une courbure suffisante pour assurer un découplage mécanique. For flat mounting of electronic microcomponents, such as chip carriers, on a printed circuit support, the electrical contacts of the microcomponent are connected to pads on the printed circuit, microcomponents having solderable contacts on a lower face thereof, comprising electrically connecting said solderable contacts of the microcomponent to respective pads on the printed circuit through sections of flexible wires having a sufficient degree of curvature for mechanically uncoupling said microcomponents from said printed circuit support and mechanically connecting the microcomponent to the support through a spacer having planar dimensions lower than planar dimensions of a base of said microcomponent for providing access to said contacts for connecting said sections thereto. An intermediate product includes the chip carrier and a grid conencted to the lower face thereof, including connecting sections and an edge strip connecting the external ends of all sections.