Stable thermally conductive composition and semiconductor device unit in which this composition is employed

• Main Author: MITSURU NITTA, YUKIO YAMAGUTI ET MUTSUO TSUJI
• Format: Patent
• Language: English; French
• Published: 21.03.1986
• Edition: 4
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A thermally conductive composition 36 consists essentially of a mixture of a silicone resin and of a thermally conductive powder, in which the silicone resin becomes, after curing, an elastic resin in gel form. The thermally conductive powder may be a metal powder. When it is intended to obtain an e...