Stable thermally conductive composition and semiconductor device unit in which this composition is employed

• Main Author: MITSURU NITTA, YUKIO YAMAGUTI ET MUTSUO TSUJI
• Format: Patent
• Language: English; French
• Published: 21.03.1986
• Edition: 4
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A thermally conductive composition 36 consists essentially of a mixture of a silicone resin and of a thermally conductive powder, in which the silicone resin becomes, after curing, an elastic resin in gel form. The thermally conductive powder may be a metal powder. When it is intended to obtain an electrical insulation, the thermally conductive powder is preferably a metal oxide powder. In all cases the silicone resin may constitute approximately 30 parts of the mixture. The thermally conductive powder may comprise approximately 70 parts by volume when the density is measured after passing. The curing may be performed by heating the composition to an elevated temperature, for example 120 DEG C, for a period of 30 minutes. Depending on the type of silicone resin, the curing is performed without addition of a catalyst, with or without application of heat. In a semiconductor device unit 16, such as an integrated circuit unit or a chip base, the composition is used effectively to fill the space separating a semiconductor device and a radiator component 31 with the cured composition to give a resin in gel form. UNE COMPOSITION 36 CONDUCTRICE DE LA CHALEUR EST CONSTITUEE ESSENTIELLEMENT D'UN MELANGE D'UNE RESINE DE SILICONE ET D'UNE POUDRE CONDUCTRICE DE LA CHALEUR, DANS LEQUEL LA RESINE DE SILICONE DEVIENT, APRES DURCISSEMENT, UNE RESINE ELASTIQUE A L'ETAT DE GEL. LA POUDRE CONDUCTRICE DE LA CHALEUR PEUT ETRE UNE POUDRE METALLIQUE. LORSQU'ON SOUHAITE OBTENIR UN ISOLEMENT ELECTRIQUE, LA POUDRE CONDUCTRICE DE LA CHALEUR EST DE PREFERENCE UNE POUDRE D'OXYDE METALLIQUE. EN TOUT CAS, LA RESINE DE SILICONE PEUT CONSTITUER ENVIRON 30PARTIES DU MELANGE. LA POUDRE CONDUCTRICE DE LA CHALEUR PEUT COMPORTER ENVIRON 70PARTIES EN VOLUME LORSQU'ON MESURE LA DENSITE VOLUMIQUE APRES PASSAGE. LE DURCISSEMENT PEUT ETRE EXECUTE EN CHAUFFANT LA COMPOSITION JUSQU'A UNE TEMPERATURE ELEVEE, PAR EXEMPLE 120C, PENDANT UNE DUREE DE 30MINUTES. SELON LE TYPE DE RESINE DE SILICONE, LE DURCISSEMENT EST EFFECTUE SANS ADDITION D'UN CATALYSEUR AVEC OU SANS APPLICATION DE CHALEUR. DANS UN BLOC DE DISPOSITIF SEMI-CONDUCTEUR 16, TEL QU'UN BLOC DE CIRCUIT INTEGRE OU UN SUPPORT DE PUCE, LA COMPOSITION SERT EFFECTIVEMENT A REMPLIR L'ESPACE SEPARANT UN DISPOSITIF SEMI-CONDUCTEUR ET UN ELEMENT DE RADIATEUR 31 AVEC LA COMPOSITION DURCIE POUR DONNER UNE RESINE A L'ETAT DE GEL.AUCUNE DEMANDEN'EST PUBLIEE SOUS CE NUMERO