BLOC DE CIRCUITS A INTEGRATION A GRANDE ECHELLE
A large scale integrated circuit package is described wherein insulating layers of an organic material are provided between wiring layers to reduce the characteristic impedance of signal wiring. To avoid deformation of the organic insulating layers and subsequent damage to wiring layers, leads for c...
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Main Author | |
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Format | Patent |
Language | French |
Published |
15.05.1987
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Edition | 4 |
Subjects | |
Online Access | Get full text |
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Summary: | A large scale integrated circuit package is described wherein insulating layers of an organic material are provided between wiring layers to reduce the characteristic impedance of signal wiring. To avoid deformation of the organic insulating layers and subsequent damage to wiring layers, leads for connecting the circuits of an integrated circuit chip to electrode pads are mechanically connected to the electrode pads on an upper layer of organic insulating material by a gold-tin eutectic alloy. |
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Bibliography: | Application Number: FR19850006423 |