Aluminum heatsink, for multiforma mounting, high power led (Machine-translation by Google Translate, not legally binding)

The present invention relates to an aluminum heat sink, for multiform mounting, of high power led, which is configured from a partially hollow cylinder, with two chambers in which it is coupled, in one the pcb board and in the other led diode, sealing that of the pcb board directly on it and that of...

Full description

Saved in:
Bibliographic Details
Main Authors MORION BIBILONI, MARCOS, MERINO DE LA ROSA, PASCUAL
Format Patent
LanguageEnglish
Spanish
Published 23.10.2014
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The present invention relates to an aluminum heat sink, for multiform mounting, of high power led, which is configured from a partially hollow cylinder, with two chambers in which it is coupled, in one the pcb board and in the other led diode, sealing that of the pcb board directly on it and that of the led diode, by fixing the optics; externally, the cylinder is completely grooved for greater dissipation power, greater mechanical strength and the possibility of an overall architecture. (Machine-translation by Google Translate, not legally binding) La presente invención se refiere a un disipador de calor de aluminio, para montaje multiforma, de led de alta potencia, que se configura a partir de un cilindro parcialmente hueco, con dos cámaras en las que se acoplan, en una la placa PCB y en la otra el diodo led, sellándose la de la placa PCB directamente sobre ella y la del diodo led, mediante la fijación de la óptica; externamente, el cilindro se presenta completamente ranurado para mayor facultad de disipación, mayor resistencia mecánica y posibilidad de arquitectura de conjunto.
Bibliography:Application Number: ES20130030591